Home Bots & Brains Black Sesame Unveils Robot Chips for Edge AI

Black Sesame Unveils Robot Chips for Edge AI

by Pieter Werner

Black Sesame Technologies presented its latest robotics system solutions at Asia Tech x Singapore (ATxSG) at the Singapore EXPO Convention Center. Exhibiting in the TechXLR8Asia zone, the company highlighted developments centered on robotics hardware and software powered by its proprietary SoC chips.

The company showcased a complete robotics system built on its Huashan A1000 and Wudang C1200 chip series. These chips are used in system-on-module (SOM) boards designed to reduce development time and improve energy efficiency. Developer kits, compatible with ROS1 and ROS2, were presented as ready-to-use platforms for prototyping applications such as simultaneous localization and mapping (SLAM) and multisensor integration.

A logistics robot prototype was demonstrated at the event, incorporating the Wudang C1200 chip and a large language model (LLM) for edge-based autonomous navigation. This system is intended for use in industrial automation, logistics, and smart mobility applications.

Since establishing its Singapore office in 2018, Black Sesame Technologies has expanded its local presence to support clients in Southeast Asia. The company stated it will continue to grow regional partnerships aimed at scaling robotics deployment in manufacturing, services, and urban infrastructure.

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