Infineon Technologies AG and HTEC presented a jointly developed humanoid robotic head at OktoberTech Silicon Valley 2025 in Palo Alto. The demonstration marked a further stage in the companies’ collaboration in embedded engineering, sensor fusion, and AI integration. The system, described as a 360-degree awareness robotic head, received the event’s Partner Innovation Award.
According to Infineon, the project integrates the company’s XENSIV 60 GHz radar for spatial awareness, REAL3 Time-of-Flight sensors for depth measurement, and digital MEMS microphones for audio processing. These components enable the device to detect presence, determine the direction of sound, orient toward it, and analyze visual information through cameras. Infineon representatives said the demonstration illustrates how combined sensing and processing technologies can support more perceptive machine behavior.
HTEC led the design, system integration, and software development. The company said it unified radar, ToF, and audio inputs into a single control architecture that can process multiple types of environmental data in real time. HTEC noted that the system is intended to show how similar capabilities could be incorporated into commercial robotics and automation projects.
Both companies stated that the robotic head is built on standard embedded hardware and software to support integration into customer platforms. Potential uses referenced by the partners include care robotics, autonomous delivery devices, smart home equipment, and security systems requiring contextual awareness and human-machine interaction.
